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CUPL Hosts the 7th Online Study Abroad Fair for Master Scholarship Programs

Time:2020-11-13    Author:国际合作与交流处     ClickTimes:

On October 24, 2020, the 7th "Study Abroad Fair for Master Scholarship Programs" was successfully held online. The event was attended by 40 representatives from 21 partner universities in eight countries, including Université de Montréal, Washington University in St. Louis, Indiana University Bloomington, The Ohio State University, College of William & Mary, University of Southern California, University of Bristol, University of Leeds, University College Dublin, Leiden University, The University of Queensland, The University of Auckland, etc. The four-session event lasted for 4 hours in total and attracted more than 200 participants per session.

Shi Jianzhong,Vice President of CUPL delivered a video speech at the opening ceremony of the online event. In his speech, Vice President Shi expressing heartfelt thanks to foreign partner universities that have long supported CUPL's international cooperation and have overcome the constraints of time and space to attend the event. He highly commended the online 7th "Study Abroad Fair for Master Scholarship Programs" and emphasized that, "As an important platform of CUPL in cultivating high-end international talents, the 'Study Abroad Fair for Master Scholarship Programs' not only provides CUPL students with a precious opportunity to study in world-class universities, but also acts as an a positive and meaningful attempt for Chinese and foreign universities to jointly establish a mutually beneficial and win-win cooperation mode."

The participating partner universities then gave presentations to the students on their respective university, program advantages, scholarship quota, application requirements and precautions, etc. They also interacted with students and answered questions.